家居五金模板

Guangdong Taijin Semiconductor Technology Co., Ltd., established in 2010, is a high-tech enterprise specializing in the research and development and production of semiconductor packaging equipment. The main business scope includes: Auto molding system ,semiconductor transfer molding system ,Trim and Form Singulation System,Leadframe transfer molding,semiconductor chip packaging machine,Trim & Form Tools,LeadFrame stamp tools,MGP Mold,An auto degating system molds. Widely used in solid-state and liquid packaging of MicroLED&MiniLED in semiconductor discrete devices, capacitors, inductors, resistors, bridge circuits, automotive electronics, and LED industries.