Auto Trim/Form System
Main Features
Function: After plastic packaging, the product is cut, bent, separated, and collected;Cutting speed: 70-100 strokes per minute (SPM: 70-100)
Applicable packaging: SOT/SOD/TSOT/SOP/TO252/TO263/SMD and other series;
Punching power: servo motor upper power -3~5T;
Control system: PLC (Omron)
Operating system: touch screen+operation buttons, displaying UPH/SPM punching count function;
Detection system: dual mirror CCD image detection for incoming and outgoing materials;
Feeding mechanism: rotating double clip feeding;
Material receiving mechanism: automatic feeding of material into the box (in bulk)
Safety protection system: The equipment is equipped with leakage protection devices, emergency stop button devices, and all main protective doors are equipped with SENSOR protection devices. After the protective doors are opened, the system should react to a certain extent to protect personal safety;
Optional 1: CCD visual detection device;
Option 2: MES system networking function.
Semiconductor back-end packaging equipment
Advantage
1. Using imported raw materials and advanced equipment for manufacturing and testing, with high equipment accuracy and stable performance;2. Customized according to needs, with strong wear resistance, long service life, guaranteed quality, and worry free after-sales service.
Equipment Details
Sample Display