IC Leadframe stamp tools SOP16L-12R



IC FrameLead transfer tools

With the characteristics of high precision and high strength, this type of mold is often solved by importing from abroad. Due to our continuous efforts and practice, we have designed and manufactured such molds to meet the needs of production and use. Which semiconductor tooling,spares part,and as well as plastic molding kit is need for semiconductor chip packaging machine in precision processing made by semiconductor equipment corporation.