半导体塑封模具Auto Mold Chase



Semiconductor packaging molds are also known as packaging molds (MGP molds). Chip packaging technology has undergone several generations of changes, from to, dip, sop, qfp, bga to csp and then to mcm. The packaging form has shifted from traditional single chip packaging to multi chip packaging. The transformation of packaging form has led to the continuous improvement of packaging mold application technology, and traditional single injection head packaging molds can no longer meet packaging requirements, The mold structure has developed from single cylinder mold to multi injection head packaging mold (mgp) to integrated circuit automatic packaging system.


Main Packaging Forms

TO series: T0220/263/247/252/3P, etc;

SOP series: SOP4/6/8/1 0/12/14/16/20/28, etc;
DIP series: DIP4/8/14/16/18/23/24/25/29/40, etc;
SOT series: SOT23/25/26/223/89, etc;
SOD series: S0D123/323/523/723/923, etc;
QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc;
QFP/IPM series, etc.


Advantages And Characteristics

1. Using imported raw materials and utilizing advanced imported equipment for manufacturing and testing;

2. Customized according to needs, with high precision, strong wear resistance, and long mold life;
3. Strong stability, guaranteed quality, and worry free after-sales service.


Technical Parameter

1. Design of multiple injection heads driven by double oil cylinders for lower injection molding combined with built-in gear and rack drive;

2. The Cavity Bar is made of high-speed powder steel with a hardness of HRC62-64;
3. Surface vacuum coating, with a lifespan of no less than 300000 cycles;
4. The surface roughness of the cavity can achieve 0.2um.max;
5. Special products can be added with vacuum pumping and built-in core pulling mechanism design;
6. According to different lead frame sizes, the maximum production capacity of 8 pieces/12 pieces/16 pieces per mold can be achieved.


‍Plastic sealing mold components‍‍

塑封模具部件塑封模具部件


Sample Display

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