Semiconductor cutting and forming separation system
Semiconductor cutting and forming separation system
Characteristic
According to different rib cutting products, they can be divided into SOP type all-in-one machines, SSOP type all-in-one machines, TSSOP all-in-one machines, MSOP all-in-one machines
Equipment function: After plastic sealing, the product is cut and bent into shape;
Applicable packaging: SOP/SSOP/TSOP/TSOP/TO/DIP and other series;
Punching power: servo motor upper power -3~5T;
Cutting speed: 50-100 strokes per minute (SPM: 50-100)
Control system: PLC (Omron)
Operating system: touch screen+buttons, displaying UPH/SPM punching count;
Feeding structure: rotating double magazine feeding;
Material receiving mechanism: material pipe receiving (pipe assembly)
Safety protection system: The equipment is equipped with leakage protection devices, emergency stop button devices, and all main protective doors are equipped with SENSOR protection devices;
Optional 1: CCD visual detection device;
Option 2: MES system networking function;
Advantage
1. Using imported raw materials and advanced equipment for manufacturing and testing, with high equipment accuracy and stable performance;2. Customized according to needs, with strong wear resistance, long service life, guaranteed quality, and worry free after-sales service.
Equipment Details
Sample Display
