Semi MGP Mold
Semi MGP Mold
Main Packaging Forms
SOP series: SOP4/6/8/1 0/12/14/16/20/28, etc
DIP series: DIP4/8/14/16/18/23/24/25/29/40, etc
SOT series: SOT23/25/26/223/89, etc
SOD series: S0D123/323/523/723/923, etc
QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc
QFP/IPM series, etc.
Technical Parameter
1. Design of multiple injection heads driven by double oil cylinders for lower injection molding combined with built-in gear and rack drive;2. The Cavity Bar is made of high-speed powder steel with a hardness of HRC62-64;
3. Surface vacuum coating, with a lifespan of no less than 300000 cycles;
4. The surface roughness of the cavity can achieve 0.2um.max;
5. Special products can be added with vacuum pumping and built-in core pulling mechanism design;
6. According to different lead frame sizes, the maximum production capacity of 8 pieces/12 pieces/16 pieces per mold can be achieved.
Advantage
1. Using imported raw materials and utilizing advanced imported equipment for manufacturing and testing;2. Customized according to needs, with high precision, strong wear resistance, and long mold life;
3. Ensure quality and worry free after-sales service.
Plastic packaging molds and MGP molds are also known as semiconductor plastic packaging molds. Chip packaging technology has undergone several generations of changes, from to, dip, sop, qfp, bga to csp and then to mcm. The packaging form has shifted from traditional single chip packaging to multi chip packaging. The transformation of packaging form has led to the continuous improvement of packaging mold application technology, and traditional single injection head packaging molds can no longer meet packaging requirements, The mold structure has developed from single cylinder mold to multi injection head packaging mold (mgp) to integrated circuit automatic packaging system.
Plastic Sealing Mold Components
Sample Display
