Semiconductor automatic chip setter

‍Semiconductor automatic chip setter‍‍

Semiconductor automatic wafer placement machine, also known as semiconductor automatic wafer placement equipment, is an important part of achieving automation in semiconductor IC packaging production. The main processes of IC packaging include: feeding, rail transportation, wafer placement, and preheating. The wafer placement machine mainly plays a role in automatic wafer placement and heating during the production process, and its completion quality will directly affect the efficiency and quality of the next step of packaging. The current packaging technology requires automatic lamination machines to complete lamination work at high speed, accurately, and automatically preheat evenly.

Advantage

2. Customized according to needs, with strong wear resistance, long service life, guaranteed quality, and worry free after-sales service.

Main Features

Applicable packaging: all packaging;
Control system: PLC (Omron)
Operating system: touch screen+operation buttons;
Safety protection system: emergency stop button device, light curtain protection device, and three side safety door design. After the protective door is opened, the system stops all actions, and after the door is closed, it resumes continuous action to protect personal safety.

Equipment Details

Sample Display